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元器件交易网讯 3月12日消息，据外媒报道，三星电子3月11日宣布将量产高级版个人电脑和移动设备内存。
三星称，4GB DDR3基于20纳米技术，将广泛用于计算应用程序。芯片生产力比25纳米的DDR3高出30%以上，是30纳米版本的两倍。DDR3是一种现代的动态随机存储器.
公司内存销售和营销部门执行总裁Jun Young-hyun说：“(产品)将迅速扩大到整个IT市场包括PC和移动市场,迅速成为主流产品。”
（元器件交易网董蕾 译）
外媒原文如下：
Samsung Electronics said Tuesday it is set to mass-produce what it claims is the most advanced version of a type of memory commonly used in PCs and mobile devices.
The 4-gigabit double data rate-3 modules based on 20-nanometer class technology will be used in a wide range of computing applications. Manufacturing productivity for the chips is over 30 percent higher than that of the 25-nanometer DDR3, and double that of the 30-nanometer class versions, according to Samsung. DDR3 is a modern type of dynamic random access memory.
“(The product) will rapidly expand its market base throughout the IT industry including the PC and mobile markets, quickly moving to mainstream status,” said Jun Young-hyun, executive president of the firm"s memory sales and marketing division.
