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中兴青漾2元器件交易网讯 3月12日消息，据中兴手机营销战略主管吕钱浩(Lu Qianhao)表示，随着公司加深对高端智能手机市场的部署，中兴通讯(000063,股吧)将进一步加强与台湾印刷电路板供应商的合作，并寻求联合台湾PCB制造商共同设计中高端印刷电路板，以及OEM PCB生产。
吕表示，中兴通讯此前从台湾的印刷电路板供应商直接或间接地购买了大约30-40%的手机印刷电路板，公司将专注于生产200美元以下的智能手机。
从采购数量看，中兴通讯将从台湾厂商购买更多的电路板。由于中兴在2014年将更多精力专注于200-400美元的智能手机市场，这将需要更多的高端印刷线路板，如HDI板和柔性电路板。
中兴通讯2014年已出货4200万部智能手机，并计划出货6000万部，吕钱浩透露，在未来的3-5年内，其目标出货量将约为1亿部。 （元器件交易网郭路平 译）
外文：
ZTE to deepen cooperation with Taiwan-based PCB suppliers
ZTE will further strengthen its cooperation with Taiwan-based PCB suppliers as it is deepening its deployment in the high-end smartphone segment, according to Lu Qianhao, ZTE"s head of handset marketing strategy.
Previously, ZTE purchased about 30-40% of handset-use PCBs directly or indirectly from Taiwan-based PCB suppliers while we were focusing on production of sub-US$200 smartphones, Lu said.
ZTE will buy more PCBs from Taiwan makers in terms of purchasing value as the company is now switching its efforts to focus on the US$200-400 smartphone segment in 2014, which needs more high-end PCBs such as HDI boards and flexible PCBs, Lu stated.
ZTE is also looking to cooperate with Taiwan-based PCB makers in joint design of mid-range to high-end PCBs as well as OEM PCB production, Lu added.
ZTE shipped 42 million smartphones in 2014, and aims to ship 60 million units in 2014 and to about 100 million units in 3-5 years, Lu revealed.
